Simulation of dual bondhead wirebonder

由 Chan, Lap Chi.
出版 2008

Method to enhance global planarization of silicon oxide surface for IC device fabrication

由 SOO, CHOI PHENG, CHAN, LAP
出版 2012

Method for forming self-aligned elevated transistor

由 CHAN, LAP, CHA, CHER LIANG
出版 2012

Method to fabricate a large planar area ONO interpoly dielectric in flash device

由 CHAN, LAP, CHA, CHER LIANG
出版 2012

Method to form shallow junction transistors while eliminating shorts due to junction spiking

由 CHAN, LAP, CHA, CHER LIANG, SUNDARESAN, RAVISHANKAR
出版 2012

Method to deposit a platinum seed layer for use in selective copper plating

由 ZHOU, MEI SHENG, XU, GUO-QIN, CHAN, LAP
出版 2012

Simplified dual damascene process utilizing PPMSO as an insulator layer

由 SOO, CHOI PHENG, LOH, WYE BOON, CHAN, LAP
出版 2012

Method to fabricate a double-polysilicon gate structure for a sub-quarter micron self-aligned-titanium silicide process

由 PEY, KIN-LEONG, HO, CHAW SING, CHAN, LAP
出版 2012

Method to form narrow and wide shallow trench isolations with different trench depths to eliminate isolation oxide dishing

由 CHAN, LAP, CHA, CHER LIANG, LEE, TECK KOON
出版 2012

Method to form shallow trench isolation structures for borderless contacts in an integrated circuit

由 GOH, KENNY HUA KOOI, CHAN, LAP, YAP, KOK SIONG
出版 2012

Method for fabricating semiconductor devices with reduced junction diffusion

由 COLOMBEAU, BENJAMIN, YEONG, SAI HOOI, BENISTANT, FRANCIS, INDAJANG, BANGUN, CHAN, LAP
出版 2012

Method and apparatus to image metallic patches embedded in a non-metal surface

由 CHA, CHER LIANG RANDALL, GONG, HAO, CHOR, ENG FONG, CHAN, LAP
出版 2012

Formation of air gap structures for inter-metal dielectric application

由 SOO, CHOI PHENG, TEE, KHENG CHOK, ONG, KOK KENG, CHAN, LAP
出版 2012

Charge-induced conductance modulation of carbon nanotube field effect transistor memory devices

由 Chan, Mei Yin, Wei, Li, Chen, Yuan, Chan, Lap, Lee, Pooi See
出版 2013

Method to fabricate horizontal air columns underneath metal inductor

由 CHAN, LAP, CHEW, KOK WAI JOHNNY, CHA, CHER LIANG, CHUA, CHEE TEE
出版 2012

Method to reduce compressive stress in the silicon substrate during silicidation

由 CHA, RANDALL CHER LIANG, CHUA, CHEE TEE, PEY, KIN LEONG, CHAN, LAP
出版 2012

Method to form uniform silicide features

由 CHAN, LAP, HO, CHAW SING, LI, FONG YAU SAM, NG, HOU TEE
出版 2012

Method to fabricate horizontal air columns underneath metal inductor

由 CHAN, LAP, CHEW, KOK WAI JOHNNY, CHA, CHER LIANG, CHUA, CHEE TEE
出版 2012

Passivation of copper interconnect surfaces with a passivating metal layer

由 CHAN, LAP, YAP, KUAN PEI, TEE, KHENG CHOK, IP, FLORA S., LOH, WYE BOON
出版 2012

Passivation of copper interconnect surfaces with a passivating metal layer

由 CHAN, LAP, YAP, KUAN PEI, TEE, KHENG CHOK, IP, FLORA S., LOH, WYE BOON
出版 2012