Bed of nails - 100-μm-pitch wafer-level interconnections process

• Main Authors: Vempati, S.R., Tay, A.A.O., Kripesh, V., Yoon, S.W.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Failure analysis; Packaging; Photolithography; Reliability
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/84883

10.1109/TEPM.2008.2004500