APA引文

Srinivasarao, V., Jayaganthan, R., Sekhar, V., Mohankumar, K., Tay, A., Kripesh, V., & ENGINEERING, M. (2014). Nanoindentation study of the sputtered Cu thin films for interconnect applications.

Chicago Style Citation

Srinivasarao, V., R. Jayaganthan, V.N Sekhar, K. Mohankumar, A.A.O Tay, V. Kripesh, and MECHANICAL ENGINEERING. Nanoindentation Study of the Sputtered Cu Thin Films for Interconnect Applications. 2014.

MLA引文

Srinivasarao, V., et al. Nanoindentation Study of the Sputtered Cu Thin Films for Interconnect Applications. 2014.