APA استشهاد

Srinivasarao, V., Jayaganthan, R., Sekhar, V., Mohankumar, K., Tay, A., Kripesh, V., & ENGINEERING, M. (2014). Nanoindentation study of the sputtered Cu thin films for interconnect applications.

استشهاد بنمط شيكاغو

Srinivasarao, V., R. Jayaganthan, V.N Sekhar, K. Mohankumar, A.A.O Tay, V. Kripesh, و MECHANICAL ENGINEERING. Nanoindentation Study of the Sputtered Cu Thin Films for Interconnect Applications. 2014.

MLA استشهاد

Srinivasarao, V., et al. Nanoindentation Study of the Sputtered Cu Thin Films for Interconnect Applications. 2014.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.