Srinivasarao, V., Jayaganthan, R., Sekhar, V., Mohankumar, K., Tay, A., Kripesh, V., & ENGINEERING, M. (2014). Nanoindentation study of the sputtered Cu thin films for interconnect applications.
استشهاد بنمط شيكاغوSrinivasarao, V., R. Jayaganthan, V.N Sekhar, K. Mohankumar, A.A.O Tay, V. Kripesh, و MECHANICAL ENGINEERING. Nanoindentation Study of the Sputtered Cu Thin Films for Interconnect Applications. 2014.
MLA استشهادSrinivasarao, V., et al. Nanoindentation Study of the Sputtered Cu Thin Films for Interconnect Applications. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.