Jayaganthan, R., Mohankumar, K., Tay, A., Kripesh, V., & ENGINEERING, M. (2014). Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications.

Jayaganthan, R., K. Mohankumar, A.A.O Tay, V. Kripesh, و MECHANICAL ENGINEERING. Fractal Analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi Interfacial Morphology in Flipchip Packaging Applications. 2014.

Jayaganthan, R., et al. Fractal Analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi Interfacial Morphology in Flipchip Packaging Applications. 2014.