Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III
Saved in:
| Main Authors: | , , |
|---|---|
| 其他作者: | |
| 格式: | Conference or Workshop Item |
| 出版: |
2014
|
| 主題: | |
| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/73403 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|