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Meng, L., S.S.P Rao, C.S Bhatia, S.E Steen, A.G Street, J.C.H Phang, and ELECTRICAL & COMPUTER ENGINEERING. Nondestructive Defect Characterization of Saw-damage-etched Multicrystalline Silicon Wafers Using Scanning Electron Acoustic Microscopy. 2014.

Meng, L., et al. Nondestructive Defect Characterization of Saw-damage-etched Multicrystalline Silicon Wafers Using Scanning Electron Acoustic Microscopy. 2014.