APA引文

CHUAN, O. K., & ENGINEERING, M. (2011). Dynamic material characterisation of solder interconnects in microelectronic packaging.

Chicago Style Citation

CHUAN, ONG KAI, and MECHANICAL ENGINEERING. Dynamic Material Characterisation of Solder Interconnects in Microelectronic Packaging. 2011.

MLA引文

CHUAN, ONG KAI, and MECHANICAL ENGINEERING. Dynamic Material Characterisation of Solder Interconnects in Microelectronic Packaging. 2011.

警告：這些引文格式不一定是100％准確.