APA引文

Zuruzi, A., Lahiri, S., Burman, P., Siow, K., & PROBABILITY, S. &. A. (2014). Correlation between intermetallic thickness and roughness during solder reflow.

Chicago Style Citation

Zuruzi, A.S., S.K Lahiri, P. Burman, K.S Siow, and STATISTICS & APPLIED PROBABILITY. Correlation between Intermetallic Thickness and Roughness During Solder Reflow. 2014.

MLA引文

Zuruzi, A.S., et al. Correlation between Intermetallic Thickness and Roughness During Solder Reflow. 2014.