Peng, L., Zhang, L., Li, H. Y., Fan, J., Lim, D. F., Tan, C. S., & Engineering, S. o. E. a. E. (2013). Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking.

Peng, L., L. Zhang, H. Y. Li, Ji Fan, Dau Fatt Lim, Chuan Seng Tan, and School of Electrical and Electronic Engineering. Ultrafine Pitch (6-µm) Evolution of Cu-Cu Bonded Interconnects in 3D Wafer-on-wafer Stacking. 2013.

Peng, L., et al. Ultrafine Pitch (6-µm) Evolution of Cu-Cu Bonded Interconnects in 3D Wafer-on-wafer Stacking. 2013.