Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model

• المؤلفون الرئيسيون: Shang, Yang, Zhang, Chun, Yu, Hao, Tan, Chuan Seng, Zhao, Xin, Lim, Sung Kyu
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/96541; http://hdl.handle.net/10220/17271

3D physical design needs accurate device model of through-silicon vias (TSVs). In this paper, physics-based electrical-thermal model is introduced for both signal and dummy thermal TSVs with the consideration of nonlinear electrical-thermal dependence. Taking thermal-reliable 3D clock-tree synthesis...