Chong, S. P., Law, S. B., Ee, E. Y. C., Chen, Z., & Engineering, S. o. M. S. &. (2012). Electroless copper seed layer deposition on tantalum nitride barrier film.
Chicago Style CitationChong, S. P., S. B. Law, Elden Yong Chiang Ee, Zhong Chen, and School of Materials Science & Engineering. Electroless Copper Seed Layer Deposition On Tantalum Nitride Barrier Film. 2012.
MLA CitationChong, S. P., et al. Electroless Copper Seed Layer Deposition On Tantalum Nitride Barrier Film. 2012.
Warning: These citations may not always be 100% accurate.