Xu, H., Liu, C., Chen, Z., Wei, J., Sivakumar, M., Silberschmidt, V. V., & Engineering, S. o. M. S. &. (2012). Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution.

Xu, Hui, Changqing Liu, Z. Chen, J. Wei, M. Sivakumar, Vadim V. Silberschmidt, and School of Materials Science & Engineering. Effect of Bonding Duration and Substrate Temperature in Copper Ball Bonding On Aluminium Pads: A TEM Study of Interfacial Evolution. 2012.

Xu, Hui, et al. Effect of Bonding Duration and Substrate Temperature in Copper Ball Bonding On Aluminium Pads: A TEM Study of Interfacial Evolution. 2012.