Thermal management of integrated electronics

• 主要作者: Koh, Sheilina Yu Fang
• 其他作者: Tan Chuan Seng
• 格式: Final Year Project
• 語言: English
• 出版: 2015
• 主題: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• 在線閱讀: http://hdl.handle.net/10356/63871
• 機構: Nanyang Technological University

With technology advancing exponentially, sizes of these electronic devices are decreasing as well. As the sizes decreases, the area for heat dissipation will be smaller. This will in turn lead to a rise in temperature which the integrated circuit (IC) may not be able to withstand. This may cause the...