Modeling of microstructure evolution during cold wire drawing process and properties determination
Wire drawing is the most widely employed process for manufacturing the micrometer sized gold wire (φ10 − φ50 μm) used for electronic interconnects. Currently, gold wire is applied in the bonding pad and miniaturization has resulted in need of higher quality of wire; wire quality is dependent on mech...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2012
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| 在線閱讀: | https://hdl.handle.net/10356/50760 |
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| 機構: | Nanyang Technological University |
| 語言: | English |