The analysis of leadframe packages reliability for automotive applications under thermal cycling
Lead frame packaging technology is extensively employed in automotive and industrial applications due to its cost-effectiveness, strong thermal performance, and mechanical stability. Among such packages, Quad Flat Non-Lead (QFN) packages present critical challenges in board-level solder joint...
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| 格式: | Thesis-Master by Coursework |
| 語言: | English |
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Nanyang Technological University
2025
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/182890 |
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