Thermal aspects of urban environment in Singapore

由 Toh, Kok Chuan.
出版 2011

Laminar film condensation inside and outside vertical diverging/converging small channels : a theoretical study

由 Liu, Pengfei, Ho, Jin Yao, Wong, Teck Neng, Toh, Kok Chuan
出版 2021

Convective filmwise condensation on the outer surface of a vertical tube : a theoretical analysis

由 Liu, Pengfei, Ho, Jin Yao, Wong, Teck Neng, Toh, Kok Chuan
出版 2021

Influence of air on heat transfer of a closed-loop spray cooling system

由 Liu, Pengfei, Kandasamy, Ranjith, Feng, Huicheng, Wong, Teck Neng, Toh, Kok Chuan
出版 2022

Fluid flow and heat transfer characteristics in microchannels

由 Ang, Gabriel Pau Hwee, Toh, Kok Chuan, Ooi, Kim Tiow, Wong, Teck Neng
出版 2008

Dynamic performance analysis and thermal modelling of a novel two-phase spray cooled rack system for data center cooling

由 Liu, Pengfei, Kandasamy, Ranjith, Ho, Jin Yao, Wong, Teck Neng, Toh, Kok Chuan
出版 2023

Development of a technique for thermal visualisation of heat transfer from fins using laser holographic interferometry

由 Leong, Kai Choong, Liu, Chang Yu, Tam, Siu Chung, Toh, Kok Chuan, Tso, Chih Ping
出版 2008

Two-phase spray cooling for high ambient temperature data centers: evaluation of system performance

由 Kandasamy, Ranjith, Ho, Jin Yao, Liu, Pengfei, Wong, Teck Neng, Toh, Kok Chuan, Chua, Sunshine Jr
出版 2022

A procedure for the motion of particle-encapsulated droplets in microchannels

由 Yap, Yit Fatt, Chai, J. C., Wong, Teck Neng, Nguyen, Nam-Trung, Toh, Kok Chuan, Zhang, H. Y., Yobas, Levent
出版 2012

Thermal modelling of integrated liquid cooling solutions for 3D stacked silicon modules

由 Sin, Kai Chieh.
出版 2009

Development of an evaporative spray cooling system for a high-power electronic test boards

由 Chen, Wenjie.
出版 2009

Thermal analysis of three-phase induction motor

由 Lin, Chenqing.
出版 2009

Modeling and analysis of thermal storage for a district cooling system (DCS)

由 Ong, Zhiguan.
出版 2009

Modeling of industrial sector in Singapore

由 Koh, Soon Peng.
出版 2009

Analysis of temperature profile on a PCB in the preheat section of a wave soldering process

由 Hoe, Swee Long.
出版 2008

Optimization of a thermoelectric cooler-heat sink combination for active CPU cooling

由 Mohd Hafiz Hasan.
出版 2010

Direct liquid cooling of stacked multichip modules

由 Chen, Xuyang.
出版 2008

Investigation of the performance of a thermosyphon pin fin heat sink

由 Sun, Jianchun.
出版 2008

Heat dissipation in ball grid array packages

由 Ying, Teck Mun.
出版 2008

Experimental and numerical evaluation of heat sink performance

由 Viswanathan Chinniah
出版 2008